High density datacenter and high performance computing
Through innovative ASUS design, it offers high density and high performance computing with extensive I/O expandability. Users also obtain greater manageability via the latest ASMB6-iKVM. The series is ideal as a computing node in HPC and IPDC markets, or in any applications that require true high density.
High density 16–DIMM memory design
ASUS Z9PH-D16/FDR boards are equipped with 16 DDR3-1600 DIMM slots in a half-size serverboard, providing high density for datacenter environments, with up to 25% more bandwidth compared to previous DDR3-1333 technology. Support for new LRDIMM gives customers access to as much as 32GB per memory module. With LRDIMM onboard, the Z9PH-D16 Series can take up to 512GB.
New InfiniBand FDR connectivity (Z9PH-D16/FDR)
With discrete Mellanox ConnectX-3, the Z9PH-D16/FDR increases networking I/O abilities and improves green data center efficiency. High density, high bandwidth, and low latency all combine on a half SSI-sized serverbord.
ASMB6-iKVM upgrade kit for easy troubleshooting
The ASMB6-iKVM enables dashboard system health monitoring, remote power on/off and control, virtual media over LAN, and management LAN fail-over support. In addition, the ASMB6 function is based on BIOS-level access, so even if the server operating system is down or offline, the KVM module can still provide round-the-clock remote monitoring and diagnosis through a user-friendly web-based graphical interface through all major browsers.
The Z9PH-D16/FDR supports new Intel E5-2600 series processors (Sandy Bridge-EP). Through the expertise of ASUS research and development, the series is also ready to support upcoming E5-2600 V2 processors (Ivy Bridge-EP), protecting customer investment with improved future-proofing. Alongside new Intel E5-2600 series processors, the Z9PH-D16/FDR provides new PCI Express 3.0 expandability, which offers higher bandwidth (up to 8GT per lane) to meet the requirements of intense HPC applications.